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Leica EM TIC 3X uses ion beams excited by an ion gun to bombard the sample vertically perpendicular to the side of the sample, resulting in high-quality stress-free "cutting" cross-sections for SEM observation. This processing method is suitable for difficult sample preparation of multi-layer film materials, soft and hard composite materials, and is easy to operate, effectively avoiding coating effects. It does not require a lot of exploration of conditions to obtain the ideal cross-section, exposing the internal fine structural information of the sample.
Order Hotline:(86)-186-0049-7749
| Leica Three Ion Beam Cutting Instrument - Leica EM TIC 3X Performance | ||
| • Excellent performance: A special three ion beam system can achieve better cross-sectional processing quality, quickly obtain wide and deep cutting areas, and greatly reduce working time. And it can handle three samples in one processing process. Therefore, for laboratories with high throughput demand, Leica EM TIC 3X is a better solution • Sample holder: A variety of sample holders suitable for various sizes of samples • Assemblable system: Targeted in Leica according to sample preparation needs EM TIC 3X Integrated Design Sample Bench Assembly - Standard Sample Bench, Diversified Sample Bench, or Frozen Sample Bench • The TOPO structure of the sample is clearly visible: in addition to cross-sectional cutting, using the same sample holder can also clean the sample and enhance the contrast function • Frozen sample stage: For temperature sensitive samples such as rubber or water-soluble polymer fibers, a frozen sample stage can be used to process the samples at low temperatures to obtain high-quality processing results. The temperature of the sample holder and baffle can both reach -150 ℃ |
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| Leica Three Ion Beam Cutting Instrument - Leica EM TIC 3X Technical Parameters | ||
| Can accommodate sample sizes up to 50x50x10mm, and can achieve effective cutting cross-sectional area>4x1mm | ||
| Three ion guns, ion beam energy 1keV-10keV, cutting rate 150 μ M/h (10keV, 50 μ M cutting height) | ||
| During ion beam processing, the sample position is fixed, without the need for deflection movement, without projection effect, and with good thermal conductivity | ||
| Can perform ion beam cutting or etching, and can choose any ion gun | ||
| Vacuum pump decoupling design, no vibration conduction | ||
| Touch screen operation panel, intuitive and easy to operate, programmable and software upgradable | ||
| Optional: Liquid nitrogen refrigeration cooling platform -150 ° to 30 °, 25L liquid nitrogen tank and automatic pump, with automatic fast cooling function | ||
| Optional: Three sample tables, capable of continuously processing three samples at once | ||
