The rapid development of the electronic industry is inseparable from the large-scale manufacturing and supply of printed circuit boards. Metallographic inspection of printed circuit boards has become a daily routine. However, regardless of the type of printed circuit board sample preparation, it is definitely polished using aluminum oxide polishing solution.


Although there are many widely used types of printed circuit boards, and a large number of printed circuit boards are composed of multiple layers of glass fibers and polymers, for metallographists, the presence of different materials in PCB printed circuit boards does not make the metallographic sample preparation process complicated, as particularly hard and brittle materials do not appear in printed circuit boards. The general preparation of printed circuit board samples refers to the preparation of bare board samples without electronic components. Generally, the first three steps are wet grinding with silicon carbide metallographic sandpaper, and the first three steps are wet grinding μ Polishing with m diamond polishing paste, later using 0.05 μ Polishing with M alumina polishing solution, these five step methods are prepared as shown in the table below.

    This simple five step method makes it easy to prepare perfect PCB samples. Because PCB measurement data are often analyzed by statistical technology, the main analysis data include coating thickness, Centre-to-centre distance of holes, etc. So not only are there requirements for the number of samples prepared, but the selection of samples also needs to be representative. It is relatively easy and convenient to take samples from the PCB board, and I will not elaborate here.


It should be noted that during inlaying, in order to improve the penetration of acrylic resin through the through holes in the board, the PCB sample can be dipped in the curing agent before inlaying, so that the acrylic resin can not only be absorbed into the through holes through Capillary action, but also the bubble phenomenon can be reduced to smaller. When grinding and polishing, the load should not be too large and the time should not be too long. The final polishing must use 0.05 μ M's aluminum oxide polishing solution can prepare very perfect printed circuit board samples.


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